CPU coolers
02 HEIGHT OPTIONSLENGTH × WIDTH × HEIGHT
160 × 94 × 36mm*
*when equipped with 15 mm fans
AMDSOCKET
AM4 / AM5125 W tested powerTest CPU: Ryzen 7 9800X3D
INTELSOCKET
LGA 1700 / 1851180 W tested powerTest CPU: Core i7-14700K
HARDWARE IN DEVELOPMENT
PCCPU & GPU cooling.
Compact system design.
Thermal hardware for high-density SFF systems. Low-profile and ultra-low-profile CPU coolers support AMD AM4/AM5 and Intel LGA 1700/1851, including vapor-chamber configurations for higher power envelopes. GPU coolers use model-specific copper cold plates or large-volume vapor chambers, 11-heatpipe architectures, and have been tested from 180 W to 350 W across the RTX 5060 Ti, 5070, 5070 Ti, and 5080.
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01 / PRODUCT RANGE
Cooler specifications.
Dimensions, platform support, tested power, and thermal
architecture for the current development range.
GPU coolers
04 MODELSLENGTH × WIDTH × HEIGHT
180 × 125 × 40mm
11 heatpipesALL GPU COOLER MODELS
GEFORCE RTX
5060 Ti
180 W tested power7 mm copper cold plateGEFORCE RTX
5070
250 W tested power7 mm copper cold plateGEFORCE RTX
5070 Ti
300 W tested powerLarge-volume vapor chamberGEFORCE RTX
5080
350 W tested powerLarge-volume vapor chamberCooling and acoustics
Each GPU cooler is developed against the factory power limit of its target board. Prototypes are tested under sustained load for thermal stability, then acoustically compared with the original cooler under matched workloads and environmental conditions.
Product range in development. Release dates and availability will be announced.
02 / MANUFACTURING & CONSTRUCTION
Thermal architecture at the component level.
Vapor chambers, heatpipes, fin geometry, machining, and assembly are developed as a coupled thermal system.
Large-volume vapor chambers
80 × 110 mm copper vapor chamber, soldered directly into the heatpipe and fin-stack assembly.
Heatpipe assembly
Eleven gravity-resistant copper heatpipes distribute heat across the fin stack, with soldered joints across the mating thermal interfaces.
Electroless nickel finish
Fin stacks are electroless nickel plated after fabrication for uniform coverage across the completed thermal structure.
Post-skive machining
Fan pockets and model-specific mounting features are machined directly into the skived fin structure after fabrication.
Dense fin arrangement
1.2 mm fin pitch concentrates heat-transfer surface area within the fixed GPU cooler envelope.
Model-specific machining
3-stage process
Model-specific geometry
Cold-plate contact area, mounting points, component clearances, and final stack height are defined around the target CPU socket or GPU PCB.
Machined interfaces
Contact surfaces, mounting features, and fan pockets are machined to the geometry of each cooler rather than shared across multiple models.
Fit verification
Mating surfaces, mounting alignment, and PCB or socket clearances are checked against the complete assembly before production release.
Thermal assembly
3-stage process
Matched thermal stack
Cold plate or vapor chamber geometry, heatpipe routing, and fin-stack layout are matched to the model-specific thermal envelope.
Soldered interfaces
Base, heatpipes, and fin stack are joined across the thermal path to maintain consistent contact and mechanical stability throughout the assembly.
Final finish
Nickel plating and final surface work are completed while preserving fin spacing, component alignment, mounting access, and required clearances.
Quality control
3-stage process
Dimensional inspection
Critical dimensions, mounting locations, contact surfaces, plating coverage, fin geometry, and soldered interfaces are inspected before final assembly.
Assembly verification
Mounting alignment, component seating, fan clearance, and chassis fit are checked on the completed cooler.
Load testing
Each development configuration is run at its target factory power limit. Thermal and acoustic data are collected under controlled, repeatable conditions for comparison with OE hardware.
03 / SYSTEM OVERVIEW
Current prototypes.
System scale, GPU-side cooling,
and CPU-side layout.
01
5 L prototype
Current 5 L development system. Cooler architecture is being designed around 4 L sandwich-style chassis constraints.
02
GPU-side assembly
Dual 87 mm high static pressure fans capable of up to 4,500 RPM.
03
CPU-side assembly
Zero space left unused.
04 / DEVELOPMENT UPDATESFollow development from
Follow development from
prototype to production.
- 01Engineering updates
- 02Thermal and acoustic test results
- 03Final specifications
- 04Launch availability